Hordhac: Caqabadaha Farsamo ee Qalabka Elektarooniga ah iyoHal-abuurka Capel
Maaddaama wadista iskeed u madaxbannaan ay u kobcayso xagga L5 iyo gaadiidka korantada (EV) nidaamyada maaraynta baytariga (BMS) waxay u baahan yihiin cufnaanta tamarta sare iyo badbaadada, tignoolajiyada PCB-ga dhaqameed waxay halgan ugu jiraan sidii ay wax uga qaban lahaayeen arrimaha muhiimka ah:
- Khatarta ka cararka kulaylkaChipset-yada ECU waxay ka badan yihiin 80W isticmaalka korantada, iyadoo heerkulku uu gaarey 150°C
- Xadka Is-dhexgalka 3D: BMS waxay u baahan tahay 256+ kanaalka calaamadaha gudaha dhumucda 0.6mm
- Guuldarrooyinka gariirkaDareemayaasha iskood isu xilqaamay waa inay u adkeystaan 20G shoog farsamo
- Baahida yaraynta: Koontaroolayaasha LiDAR waxay u baahan yihiin 0.03mm ballacyada raadraaca iyo isugaynta 32-lakab ah
Tignoolajiyada Capel, oo ka faa'iidaysanaysa 15 sano ee R&D, waxay soo bandhigaysaa xal wax-is-beddel ah oo la isku darayPCB-yada kulaylka sare leh(2.0W/mK),PCB-yada u adkaysta heerkulka sare(-55°C ~ 260°C)iyo32-lakabHDI lagu aasay/indho la' iyadoo loo marayo tignoolajiyada(0.075mm microvias).
Qaybta 1: Kacaanka Maaraynta Kulaylka ee Wadista Wadista Iswada ee ECUs
1.1 ECU Caqabadaha Kulaylka
- Cufnaanta qulqulka kuleylka Nvidia Orin chipset: 120W/cm²
- Qaybaha caadiga ah ee FR-4 (0.3W/mK) waxay sababaan 35% heerkulka isgoysyada jajabka
- 62% ee guuldarrooyinka ECU waxay ka yimaadaan daalka alxanka kuleylku ka dhashay
1.2 Tignoolajiyada Hagaajinta Kulaylka ee Capel
Cusbooneysii Agabka:
- Nano-alumina oo la xoojiyay substrates polyimide (2.0 ± 0.2W/mK kuleylka kuleylka)
- 3D tiir naxaas ah (400% oo kordhay aagga kulaylka)
Horumarka Geedi socodka:
- Qaab dhismeedka tooska ah ee leysarka (LDS) ee dariiqooyinka kulaylka la hagaajiyay
- Isku-darka isku-dhafka ah: 0.15mm naxaas khafiif ah oo khafiif ah + 2oz lakabyo naxaas ah oo culus
Isbarbardhigga Waxqabadka:
| Halbeegga | Heerka Warshadaha | Capel Solution |
|---|---|---|
| Heerkulka Isgoysyada Chip (°C) | 158 | 92 |
| Nolosha Baaskiilka kulaylka | 1,500 wareeg | 5,000+ wareegyo |
| Cufnaanta Awoodda (W/mm²) | 0.8 | 2.5 |
Qaybta 2: Kacaanka Xadhkaha BMS oo leh 32-Layer HDI Technology
2.1 Dhibcaha Xanuunka Warshadaha ee Naqshadaynta BMS
- Goobaha 800V waxay u baahan yihiin 256+ kanaalada kormeerka tamarta unugyada
- Naqshadaynta caadiga ah waxay dhaaftaa xadka booska 200% iyadoo 15% is-waafajin la'aan
2.2 Xalalka Isku xidhka Cufnaanta Sare ee Capel
Injineeriyada istakoorka:
- 1+N+1 qaab dhismeedka HDI-lakab ah (32 lakab oo dhumucdiisu tahay 0.035mm)
- ± 5% xakamaynta impedance kala duwan (10Gbps calaamadaha xawaaraha sare)
Tiknoolajiyada Microvia:
- 0.075mm laser-indho la'aan vias (12: 1 saamiga)
- <5% qiimaha faaruqinta (IPC-6012B Class 3 waafaqsan)
Natiijooyinka Benchmark:
| Metric | Celceliska Warshadaha | Capel Solution |
|---|---|---|
| Cufnaanta Kanaalka (ch/cm²) | 48 | 126 |
| Saxnaanta korantada (mV) | ±25 | ±5 |
| Daahitaanka ishaarada (ns/m) | 6.2 | 5.1 |
Qaybta 3: Isku hallaynta Deegaanka ee Ba'an - MIL-SPEC xalal la shahaaday
3.1 Waxqabadka Qalabka Heerkulka Sare
- Heerkulka Kala-guurka Dhalada (Tg): 280°C (IPC-TM-650 2.4.24C)
- Heerkulka Qulqulka (Td): 385°C (miisaan dhimis 5%)
- Badbaadinta shoogga kulaylka: 1,000 wareeg (-55°C↔260°C)
3.2 Tignoolajiyada Ilaalinta Lahaanshaha
- Dahaarka polymer-ku-meel-gaadhka ah ee Plasma (1,000h iska caabin milix ah)
- 3D EMI godadka gaashaanka (60dB attenuation @10GHz)
Qaybta 4: Daraasadda Kiiska - Wadashaqeynta Global Top 3 EV OEM
4.1 800V BMS Module Control
- Caqabad: Isku dhafka 512-kanaalka AFE ee 85 × 60mm meel bannaan
- Xalka:
- PCB 20-lakab ah oo qalloocan
- Shabakadda dareemaha heerkulka ku-xidhan (0.03mm ballaca raadraaca)
- Qaboojinta birta xudunta u ah (0.15°C·cm²/W caabbinta kulaylka)
4.2 L4 Ismaamulka Domain Control
- Natiijooyinka:
- 40% dhimista tamarta (72W → 43W)
- 66% dhimista cabbirka iyo naqshadaha caadiga ah
- Shahaadada badbaadada shaqada ee ASIL-D
Qaybta 5: Shahaadooyinka iyo Xaqiijinta Tayada
Habka tayada Capel wuxuu ka sarreeyaa heerarka baabuurta:
- Shahaadada MIL-SPEC: Waafaqsan GJB 9001C-2017
- U Hogaansanaanta Baabuurta: IATF 16949: 2016 + ansaxinta AEC-Q200
- Tijaabada isku halaynta:
- 1,000h HAST (130°C/85% RH)
- 50G shoog farsamo (MIL-STD-883H)
Gabagabo: Next-Gen PCB Technology Roadmap
Capel wuxuu hormuud ka yahay:
- Qaybaha dadban (30% kaydinta meel bannaan)
- PCB-yada isku-dhafan ee indhaha-electronic (0.2dB/cm khasaare @850nm)
- Nidaamyada DFM ee AI ay wado (15% horumarinta wax soo saarka)
La xidhiidh kooxdayada injineernimadamaanta si loo horumariyo xalalka PCB ee la habeeyey ee qalabkaaga elektiroonigga ah ee baabuurta
Waqtiga boostada: May-21-2025
Dib u noqo
